FIRMA PIEKARZ - Części Elektroniczne
Quick buy
Quickly add items to your cart:
Uwaga
In order for the website to function properly, it is required to enable Cookies in your browser. You can read more about the rules of using cookies in our privacy policy.

Silicone encapsulating compound; AGT-221 029; AG Termopasty; forms a conductive coating; filling gap

 Item 
Silicone encapsulating compound; heat transferrin; AGT-221 029; 100g+10g; liquid; forms a conductive coating; filling gaps; syringe+plastic container; AG Termopasty
Item ID: 31033
Item ID: 31033
Quantity: 0 pc
MOQ: 1
Multiple: 1
Quantity [ pc ]Net price
PLN
1+44,83
12+40,81
36+36,79
The product is no longer available. It can no longer be ordered. Maybe you can find something interesting in its group?
 Info 
The item is available on request.

 Details 
NameSilicone encapsulating compound
Typethermally conductive
SymbolAGT-221 029
Capacity / Weight100g+10g
Appearanceliquid
Applicationforms a conductive coating; filling gaps
Package typesyringe+plastic container
ManufacturerAG Termopasty
Please wait

...
Confirmation

Info