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Relay; SSR; single phase; TLP595G; 30mA; 1,2÷1,7V; DC; 150mA; 400V; DC; AC; MOSFET; PCB surface mounted; SPST NO; Toshiba

Relay; Toshiba; TLP595G; SSR; 1,2÷1,7V; 150mA
from 2,38 PLN net

Connector; instalation; XY603-B; 1 way; 21mm; 24A; 400V; for cable; straight; spring; 0,5÷2,5mm2; black; Xinya; RoHS

Connector; instalation; XY603-B; 1 way
from 0,17 PLN net

Heatsink; DY-J/6,6/A; blackened; 66mm; ribbed; 2,3K/W; 95mm; 24mm

Heatsink; DY-J/6,6/A; 66mm; 2,3K/W
from 2,25 PLN net

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Epoxy filing compounds; AGT-223; AG Termopasty; insulation; liquid; two-component; epoxy; zabezpiecz

Files to download
Datasheet \| Material Safety Data Sheet \| Material Safety Data Sheet

Epoxy filing compounds; two-component; epoxy; zabezpieczający; AGT-223; 100g+10g; liquid; insulation; metal case+syringe; AG Termopasty

Item ID: 33174

Quantity: 0 pc

MOQ: 1

Multiple: 1

Quantity [ pc ]	Net price PLN
1+	24,29
2+	21,69
12+	19,75
36+	17,80

The product is no longer available. It can no longer be ordered. Maybe you can find something interesting in its group?

Info
The item is available only until stocks last.

Details
Name	Epoxy filing compounds
Type	two-component; epoxy; zabezpieczający
Symbol	AGT-223
Capacity / Weight	100g+10g
Appearance	liquid
Application	insulation
Package type	metal case+syringe
Manufacturer	AG Termopasty